TDA75610LVPDTR
vs
TDF8541SD/N2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
| Package Description |
POWERSO-36
|
2.54 MM PITCH, PLASTIC, SOT878-1, SIL-27
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
15 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Bandwidth-Nom |
22 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
26 dB
|
|
| Harmonic Distortion |
10%
|
10%
|
| JESD-30 Code |
R-PDSO-G36
|
R-PZFM-T27
|
| Length |
15.9 mm
|
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
27
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
44 W
|
44 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
|
| Package Equivalence Code |
SSOP36,.56
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.41 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
6 V
|
6 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
ZIG-ZAG
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
11 mm
|
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SOT
|
| Pin Count |
|
27
|
| Manufacturer Package Code |
|
SOT878-1
|
|
|
|
Compare TDA75610LVPDTR with alternatives
Compare TDF8541SD/N2 with alternatives