TDA8552T/N1,518
vs
935261315118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOP
|
SOIC
|
| Package Description |
SOP,
|
PLASTIC, SOT-163, SO-20
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
SOT163-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Channel Separation |
55 dB
|
55 dB
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| Harmonic Distortion |
0.1%
|
0.1%
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
e4
|
| Length |
12.8 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Current-Max |
20 mA
|
20 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare TDA8552T/N1,518 with alternatives
Compare 935261315118 with alternatives