TDF8530TH/N2,118
vs
935297727112
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, SOT1131-1, HSOP-44
|
HSSOP,
|
| Pin Count |
44
|
|
| Manufacturer Package Code |
SOT1131-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
26 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| Gain |
26 dB
|
26 dB
|
| Harmonic Distortion |
10%
|
10%
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| Length |
15.9 mm
|
15.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
100 W
|
100 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
HSSOP
|
| Package Equivalence Code |
SSOP44,.55
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
3.5 mm
|
3.5 mm
|
| Supply Current-Max |
200 mA
|
|
| Supply Voltage-Max (Vsup) |
24 V
|
24 V
|
| Supply Voltage-Min (Vsup) |
6 V
|
6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
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