TF1109
vs
MAX31910AUI+
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
,
|
TSSOP-28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
INTERFACE CIRCUIT
|
Digital I/P Module
|
| JESD-30 Code |
R-XSMA-T5
|
R-PDSO-G28
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
28
|
| Operating Temperature-Max |
80 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom |
24 V
|
24 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
SINGLE
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.7 mm
|
| Moisture Sensitivity Level |
|
1
|
| Package Code |
|
HTSSOP
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max |
|
36 V
|
| Supply Voltage-Min |
|
7 V
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
0.65 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
4.4 mm
|
|
|
|
Compare TF1109 with alternatives
Compare MAX31910AUI+ with alternatives