TIP111 vs BUX66C feature comparison

TIP111 Bourns Inc

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BUX66C Harris Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer BOURNS INC HARRIS SEMICONDUCTOR
Part Package Code SFM
Package Description TO-220, 3 PIN FLANGE MOUNT, O-MBFM-P2
Pin Count 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 4 A 2 A
Collector-Emitter Voltage-Max 80 V 350 V
Configuration DARLINGTON SINGLE
DC Current Gain-Min (hFE) 500 10
JEDEC-95 Code TO-220AB TO-213AA
JESD-30 Code R-PSFM-T3 O-MBFM-P2
Number of Elements 1 1
Number of Terminals 3 2
Package Body Material PLASTIC/EPOXY METAL
Package Shape RECTANGULAR ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type NPN PNP
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Position SINGLE BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
HTS Code 8541.29.00.95
Collector-Base Capacitance-Max 220 pF
JESD-609 Code e0
Operating Temperature-Max 200 °C
Power Dissipation Ambient-Max 35 W
Power Dissipation-Max (Abs) 35 W
Terminal Finish TIN LEAD
Transistor Application SWITCHING
Transition Frequency-Nom (fT) 20 MHz
Turn-off Time-Max (toff) 3100 ns
VCEsat-Max 2.5 V

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