TIP29A vs MJD29C-1 feature comparison

TIP29A Bourns Inc

Buy Now Datasheet

MJD29C-1 Samsung Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer BOURNS INC SAMSUNG SEMICONDUCTOR INC
Part Package Code SFM
Package Description TO-220, 3 PIN IPAK-3
Pin Count 3 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Samacsys Manufacturer Bourns
Case Connection COLLECTOR
Collector Current-Max (IC) 1 A 1 A
Collector-Emitter Voltage-Max 60 V 100 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 15 15
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3 R-PSIP-T3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 30 W 15 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Element Material SILICON SILICON
Base Number Matches 2 1
HTS Code 8541.29.00.95
JESD-609 Code e0
Power Dissipation Ambient-Max 15 W
Terminal Finish Tin/Lead (Sn/Pb)
Transistor Application AMPLIFIER
Transition Frequency-Nom (fT) 3 MHz
VCEsat-Max 0.7 V

Compare TIP29A with alternatives

Compare MJD29C-1 with alternatives