TJA1050U/N1,005 vs TJA1050T/V,112 feature comparison

TJA1050U/N1,005 NXP Semiconductors

Buy Now Datasheet

TJA1050T/V,112 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIE SOIC
Package Description DIE, SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XUUC-N8 R-PDSO-G8
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT96-1
Data Rate 1000 Mbps
JESD-609 Code e4
Length 4.9 mm
Moisture Sensitivity Level 1
Number of Transceivers 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.75 mm
Supply Current-Max 0.075 mA
Technology CMOS
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

Compare TJA1050U/N1,005 with alternatives

Compare TJA1050T/V,112 with alternatives