TJA1051T/3/1J
vs
MCP2542FDT-E/MNY
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
|
HVSON,
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
SOT96-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
10 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
NXP
|
Microchip
|
| Data Rate |
1000 Mbps
|
8000 Mbps
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.75 mm
|
0.8 mm
|
| Supply Current-Max |
70 mA
|
140 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
CAN TRANSCEIVER
|
CAN FD TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
3.9 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-03-03
|
| Package Equivalence Code |
|
SOLCC8,.12,20
|
|
|
|
Compare TJA1051T/3/1J with alternatives
Compare MCP2542FDT-E/MNY with alternatives