TJA1057GT/3J vs TH8050 feature comparison

TJA1057GT/3J NXP Semiconductors

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TH8050 Melexis Microelectronic Integrated Systems

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS THESYS GESELLSCHAFT FUR MIKROELEKTRONIK MBH
Package Description SOP-8 SOP,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 4.9 mm 4.9 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE

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