TJA1057T,118 vs TLE7250GXUMA1 feature comparison

TJA1057T,118 NXP Semiconductors

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TLE7250GXUMA1 Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT96-1, SO-8 GREEN, PLASTIC, SOP-8
Pin Count 8
Manufacturer Package Code SOT96-1
Reach Compliance Code compliant compliant
Samacsys Manufacturer NXP Infineon
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 5 mm
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Current-Max 70 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 4 mm
Base Number Matches 1 1
Pbfree Code Yes
HTS Code 8542.39.00.01
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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