TL16C552AHV
vs
SC16C550BIN40
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
QFP
|
|
Package Description |
QFF,
|
DIP-40
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ENHANCED BIDIRECTIONAL PRINTER PORT
|
|
Address Bus Width |
3
|
|
Boundary Scan |
NO
|
|
Bus Compatibility |
PC-AT
|
|
Clock Frequency-Max |
16 MHz
|
|
Communication Protocol |
ASYNC, BIT; SYNC, BYTE; ETHERNET
|
|
Data Transfer Rate-Max |
0.125 MBps
|
|
External Data Bus Width |
8
|
|
JESD-30 Code |
S-GQFP-F68
|
R-PDIP-T40
|
Length |
12.51 mm
|
|
Low Power Mode |
NO
|
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
68
|
40
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
QFF
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.86 mm
|
|
Supply Voltage-Max |
5.25 V
|
|
Supply Voltage-Min |
4.75 V
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Pitch |
0.635 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
12.51 mm
|
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP40,.6
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TL16C552AHV with alternatives