TL16C754FN vs SC16C554BIBM,157 feature comparison

TL16C754FN Texas Instruments

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SC16C554BIBM,157 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code LCC QFP
Package Description PLASTIC, MS-018, LCC-68 LFQFP, QFP64,.35SQ,16
Pin Count 68 64
Reach Compliance Code not_compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 3.3V SUPPLY ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 0.375 MBps 0.625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQFP-G64
Length 24.23 mm 7 mm
Low Power Mode YES NO
Number of Serial I/Os 4 4
Number of Terminals 68 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC68,1.0SQ QFP64,.35SQ,16
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.6 mm
Supply Voltage-Max 5.5 V 3.63 V
Supply Voltage-Min 4.5 V 2.97 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.4 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 24.23 mm 7 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Manufacturer Package Code SOT414-1
JESD-609 Code e3
Moisture Sensitivity Level 1
Terminal Finish Matte Tin (Sn)

Compare TL16C754FN with alternatives

Compare SC16C554BIBM,157 with alternatives