TLC2202AID
vs
MC33074DTB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
PLASTIC, MS-012AB, SOIC-14
|
TSSOP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00015 µA
|
0.7 µA
|
| Common-mode Reject Ratio-Nom |
115 dB
|
97 dB
|
| Input Offset Voltage-Max |
700 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
8.65 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-8 V
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-15 V
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Slew Rate-Nom |
2.7 V/us
|
10 V/us
|
| Supply Voltage Limit-Max |
8 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
1900
|
4500
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare TLC2202AID with alternatives
Compare MC33074DTB with alternatives