TLE2024MDW
vs
HA9P4741-9
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
,
|
SOP, SOP16,.4
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
|
0.4 µA
|
| Bias Current-Max (IIB) @25C |
|
0.3 µA
|
| Common-mode Reject Ratio-Min |
|
80 dB
|
| Common-mode Reject Ratio-Nom |
|
74 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Voltage-Max |
|
8500 µV
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e0
|
| Low-Offset |
|
NO
|
| Neg Supply Voltage Limit-Max |
|
-20 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Functions |
|
4
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP16,.4
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Slew Rate-Nom |
|
1.6 V/us
|
| Supply Current-Max |
|
7 mA
|
| Supply Voltage Limit-Max |
|
20 V
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Unity Gain BW-Nom |
|
3500
|
| Voltage Gain-Min |
|
25000
|
|
|
|
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