TLE6250G vs TJA1046TK feature comparison

TLE6250G Infineon Technologies AG

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TJA1046TK NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code End Of Life Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Part Package Code SOIC
Pin Count 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Infineon NXP
Data Rate 1000 Mbps
JESD-30 Code R-PDSO-G8 R-PDSO-N14
JESD-609 Code e3
Length 5 mm 4.5 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 14
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVSON
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1 mm
Supply Current-Max 0.07 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BICMOS
Telecom IC Type CAN TRANSCEIVER INTERFACE CIRCUIT
Terminal Finish Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 4 mm 3 mm
Base Number Matches 12 2
Package Description HVSON,

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