TLE6250GPBF
vs
TJA1059TK
feature comparison
| Part Life Cycle Code |
End Of Life
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Telecom IC Type |
CAN TRANSCEIVER
|
INTERFACE CIRCUIT
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Package Description |
|
HVSON,
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-30 Code |
|
R-PDSO-N14
|
| Length |
|
4.5 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
14
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVSON
|
| Package Shape |
|
RECTANGULAR
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1 mm
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3 mm
|
|
|
|
Compare TLE6250GPBF with alternatives
Compare TJA1059TK with alternatives