TLE6250RV33
vs
MU9C8338-TFI
feature comparison
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
MUSIC SEMICONDUCTORS INC
|
Part Package Code |
SOIC
|
QFP
|
Package Description |
SOP,
|
QFP, QFP144,.87SQ,20
|
Pin Count |
8
|
144
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G8
|
S-PQFP-G144
|
Length |
5 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
144
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QFP
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BCDMOS
|
CMOS
|
Telecom IC Type |
CAN TRANSCEIVER
|
INTERFACE CIRCUIT
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
4 mm
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
QFP144,.87SQ,20
|
Supply Current-Max |
|
0.09 mA
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TLE6250RV33 with alternatives
Compare MU9C8338-TFI with alternatives