TLE6250RV33 vs MU9C8338-TFI feature comparison

TLE6250RV33 Infineon Technologies AG

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MU9C8338-TFI Music Semiconductors Inc

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INFINEON TECHNOLOGIES AG MUSIC SEMICONDUCTORS INC
Part Package Code SOIC QFP
Package Description SOP, QFP, QFP144,.87SQ,20
Pin Count 8 144
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 S-PQFP-G144
Length 5 mm
Number of Functions 1 1
Number of Terminals 8 144
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP QFP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology BCDMOS CMOS
Telecom IC Type CAN TRANSCEIVER INTERFACE CIRCUIT
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Width 4 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code QFP144,.87SQ,20
Supply Current-Max 0.09 mA
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD

Compare TLE6250RV33 with alternatives

Compare MU9C8338-TFI with alternatives