TLE9250LEXUMA1
vs
TJA1029TK/20/1J
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Package Description |
HTSON,
|
3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, SOT782-1, MO-229, HVSON-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
20 Weeks
|
10 Weeks
|
| Samacsys Manufacturer |
Infineon
|
NXP
|
| JESD-30 Code |
S-PDSO-N8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2A
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSON
|
VSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
Tin (Sn)
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SON
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
SOT782-1
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare TLE9250LEXUMA1 with alternatives
Compare TJA1029TK/20/1J with alternatives