TLV2262CP
vs
TLV2262IPE4
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP,
|
DIP, DIP8,.3
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
0.0008 µA
|
0.0008 µA
|
Common-mode Reject Ratio-Nom |
75 dB
|
75 dB
|
Input Offset Voltage-Max |
3000 µV
|
3000 µV
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
Length |
9.59 mm
|
9.59 mm
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Slew Rate-Nom |
0.55 V/us
|
0.55 V/us
|
Supply Voltage Limit-Max |
16 V
|
16 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
670
|
670
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Architecture |
|
VOLTAGE-FEEDBACK
|
Bias Current-Max (IIB) @25C |
|
0.00006 µA
|
Common-mode Reject Ratio-Min |
|
70 dB
|
Frequency Compensation |
|
YES
|
JESD-609 Code |
|
e4
|
Low-Bias |
|
YES
|
Low-Offset |
|
NO
|
Micropower |
|
YES
|
Package Equivalence Code |
|
DIP8,.3
|
Slew Rate-Min |
|
0.3 V/us
|
Supply Current-Max |
|
0.5 mA
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Voltage Gain-Min |
|
55000
|
|
|
|
Compare TLV2262CP with alternatives
Compare TLV2262IPE4 with alternatives