TLV320A1109PBSG4
vs
IDT82V1054APF
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
TFQFP, TQFP32,.28SQ
|
TQFP-64
|
Pin Count |
32
|
64
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Companding Law |
A/MU-LAW
|
A/MU-LAW
|
Filter |
YES
|
YES
|
Gain Tolerance-Max |
1 dB
|
0.25 dB
|
JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G64
|
JESD-609 Code |
e4
|
e0
|
Length |
5 mm
|
10 mm
|
Linear Coding |
15-BIT
|
16-BIT
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
64
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
LFQFP
|
Package Equivalence Code |
TQFP32,.28SQ
|
QFP64,.66SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.6 mm
|
Supply Current-Max |
0.008 mA
|
|
Supply Voltage-Nom |
3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5 mm
|
10 mm
|
Base Number Matches |
1
|
4
|
|
|
|
Compare TLV320A1109PBSG4 with alternatives
Compare IDT82V1054APF with alternatives