TLV320A1109PBSG4
vs
TLV320AIC1110GQER
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
TFQFP, TQFP32,.28SQ
|
PLASTIC, MICRO, BGA-80
|
| Pin Count |
32
|
80
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Companding Law |
A/MU-LAW
|
A/MU-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
1 dB
|
1 dB
|
| JESD-30 Code |
S-PQFP-G32
|
S-PBGA-B80
|
| JESD-609 Code |
e4
|
e0
|
| Length |
5 mm
|
5 mm
|
| Linear Coding |
15-BIT
|
15-BIT
|
| Moisture Sensitivity Level |
3
|
2A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
80
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
VFBGA
|
| Package Equivalence Code |
TQFP32,.28SQ
|
BGA80,9X9,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Current-Max |
0.008 mA
|
0.006 mA
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TLV320A1109PBSG4 with alternatives
Compare TLV320AIC1110GQER with alternatives