TLV70330DBVR
vs
TC1173-3.3VOA
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LSSOP,
|
SOP, SOP8,.25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2017-12-03
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.375 V
|
0.48 V
|
| Dropout Voltage1-Nom |
0.22 V
|
0.24 V
|
| Input Voltage-Max |
5.5 V
|
6 V
|
| Input Voltage-Min |
3.5 V
|
4.3 V
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.9 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
3.06 V
|
3.3825 V
|
| Output Voltage1-Min |
2.94 V
|
3.2175 V
|
| Output Voltage1-Nom |
3 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1.45 mm
|
1.75 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Voltage Tolerance-Max |
2%
|
2.5%
|
| Width |
1.6 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
6 Weeks
|
| Input Voltage Absolute-Max |
|
6.5 V
|
| Line Regulation-Max |
|
0.01964%
|
| Load Regulation-Max |
|
0.066%
|
| Package Equivalence Code |
|
SOP8,.25
|
| Packing Method |
|
TUBE
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
TS 16949
|
| Technology |
|
CMOS
|
|
|
|
Compare TLV70330DBVR with alternatives
Compare TC1173-3.3VOA with alternatives