TMP1075DR
vs
AT30TS74-UFM14-T-072
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
| Accuracy-Max (Cel) |
1 Cel
|
3 Cel
|
| Body Breadth |
3.91 mm
|
|
| Body Height |
1.75 mm
|
0.499 mm
|
| Body Length or Diameter |
4.9 mm
|
|
| Housing |
PLASTIC
|
PLASTIC
|
| JESD-609 Code |
e4
|
e1
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Bits |
12
|
12
|
| Number of Terminals |
8
|
4
|
| Operating Current-Max |
0.004 mA
|
0.8 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape/Style |
RECTANGULAR
|
RECTANGULAR
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
BGA4,2X2,16
|
| Factory Lead Time |
|
16 Weeks
|
| Date Of Intro |
|
2017-02-24
|
| Package Equivalence Code |
|
BGA4,2X2,16
|
|
|
|
Compare TMP1075DR with alternatives
Compare AT30TS74-UFM14-T-072 with alternatives