TMP68010P-12 vs TSX68C000MC112.5A feature comparison

TMP68010P-12 Toshiba America Electronic Components

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TSX68C000MC112.5A Teledyne e2v

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP E2V TECHNOLOGIES PLC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 64 64
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 23 24
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 12.5 MHz 12.5 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PDIP-T64 R-CDIP-T64
JESD-609 Code e0
Length 81.535 mm 81.28 mm
Low Power Mode YES NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 64 64
On Chip Data RAM Width
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 5.84 mm 4.83 mm
Speed 12.5 MHz 12.5 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology MOS HCMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 22.86 mm 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
ECCN Code 3A001.A.2.C

Compare TMP68010P-12 with alternatives

Compare TSX68C000MC112.5A with alternatives