TMP68881YC-12 vs SPAK68882CFN25A feature comparison

TMP68881YC-12 Toshiba America Electronic Components

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SPAK68882CFN25A Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA INC
Part Package Code PGA
Package Description PGA, QCCJ,
Pin Count 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 5
Boundary Scan NO NO
Clock Frequency-Max 12.5 MHz 25 MHz
External Data Bus Width 32 32
JESD-30 Code S-CPGA-P68 S-PQCC-J68
Length 26.92 mm 24.2062 mm
Number of Terminals 68 68
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA QCCJ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.59 mm 4.57 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS HCMOS
Terminal Form PIN/PEG J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 26.92 mm 24.2062 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 1 2
Bus Compatibility MC68020; MC68030
Operating Temperature-Max 70 °C
Operating Temperature-Min

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