TMP86P808DM vs TMP86C808DM feature comparison

TMP86P808DM Toshiba America Electronic Components

Buy Now Datasheet

TMP86C808DM Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code SSOP SSOP
Package Description LSSOP, SOP, SSOP30,.3
Pin Count 30 30
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature OPERATES AT 2.7V MINIMUM SUPPLY @ 8 MHZ OPERATES AT 2.7 V MINIMUM SUPPLY @ 8 MHZ
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G30 R-PDSO-G30
Length 9.7 mm 9.7 mm
Number of I/O Lines 24 24
Number of Terminals 30 30
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
ROM Programmability OTPROM MROM
Seated Height-Max 1.6 mm 1.6 mm
Speed 16 MHz 16 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.6 mm 5.6 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
CPU Family TLCS-870/C
JESD-609 Code e0
On Chip Program ROM Width 8
Package Equivalence Code SSOP30,.3
RAM (bytes) 256
ROM (words) 8192
Supply Current-Max 9 mA
Terminal Finish TIN LEAD

Compare TMP86P808DM with alternatives

Compare TMP86C808DM with alternatives