TMP95C265F
vs
TMP95C265FG
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
FQFP, QFP100,.63SQ,20
|
LFQFP,
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
OPERATES AT 2.7V MINIMUM SUPPLY @ 10 MHZ
|
ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 10 MHZ
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
16
|
CPU Family |
TLCS-900/H
|
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
Length |
14 mm
|
14 mm
|
Number of I/O Lines |
55
|
55
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
LFQFP
|
Package Equivalence Code |
QFP100,.63SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
2048
|
|
Seated Height-Max |
1.85 mm
|
1.6 mm
|
Speed |
25 MHz
|
25 MHz
|
Supply Current-Max |
50 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
3
|
2
|
Pbfree Code |
|
Yes
|
|
|
|