TMS320C6454BGTZ
vs
TMX320C6454ZTZ7
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
FBGA, BGA697,29X29,32
|
BGA,
|
| Pin Count |
697
|
697
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
50 MHz
|
66 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B697
|
S-PBGA-B697
|
| JESD-609 Code |
e0
|
|
| Length |
24 mm
|
|
| Low Power Mode |
YES
|
NO
|
| Moisture Sensitivity Level |
4
|
|
| Number of Terminals |
697
|
697
|
| Operating Temperature-Max |
90 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
BGA
|
| Package Equivalence Code |
BGA697,29X29,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
262144
|
|
| Seated Height-Max |
3.242 mm
|
|
| Supply Voltage-Max |
1.2875 V
|
1.89 V
|
| Supply Voltage-Min |
1.2125 V
|
1.71 V
|
| Supply Voltage-Nom |
1.25 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare TMS320C6454BGTZ with alternatives
Compare TMX320C6454ZTZ7 with alternatives