TMS320C6455BCTZ vs TMS320C6455DZTZ7 feature comparison

TMS320C6455BCTZ Texas Instruments

Buy Now Datasheet

TMS320C6455DZTZ7 Texas Instruments

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA
Pin Count 697
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 20
Barrel Shifter NO NO
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.6 MHz
External Data Bus Width 64
Format FIXED POINT FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B697 S-PBGA-B697
JESD-609 Code e1
Length 24 mm 24 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4
Number of DMA Channels 64
Number of Terminals 697 697
Number of Timers 4
Operating Temperature-Max 90 °C 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA FBGA
Package Equivalence Code BGA697,29X29,32 BGA697,29X29,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (words) 8192 8192
Seated Height-Max 3.242 mm 3.242 mm
Supply Voltage-Max 1.2875 V 1.236 V
Supply Voltage-Min 1.2125 V 1.164 V
Supply Voltage-Nom 1.25 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 24 mm 24 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 5 1
Package Description FBGA, BGA697,29X29,32

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Compare TMS320C6455DZTZ7 with alternatives