TMS320F2812PBKS
vs
SM320F2812GHHMEP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
LFQFP,
|
BGA-179
|
| Pin Count |
176
|
179
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V I/O SUPPLY
|
ALSO OPERATES AT 1.8V SUPPLY AT 135MHZ
|
| Address Bus Width |
19
|
19
|
| Barrel Shifter |
NO
|
NO
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
150 MHz
|
150 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQFP-G176
|
S-PBGA-B179
|
| Length |
14 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
176
|
179
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.4 mm
|
| Supply Voltage-Max |
2 V
|
2 V
|
| Supply Voltage-Min |
1.81 V
|
1.81 V
|
| Supply Voltage-Nom |
1.9 V
|
1.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
14 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Bit Size |
|
32
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Number of External Interrupts |
|
3
|
| Number of Timers |
|
8
|
| On Chip Data RAM Width |
|
16
|
| On Chip Program ROM Width |
|
16
|
| PWM Channels |
|
YES
|
| Package Equivalence Code |
|
BGA179,14X14,32
|
| Peak Reflow Temperature (Cel) |
|
220
|
| RAM (bytes) |
|
36864
|
| RAM (words) |
|
18432
|
| ROM Programmability |
|
FLASH
|
| Supply Current-Max |
|
230 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare TMS320F2812PBKS with alternatives
Compare SM320F2812GHHMEP with alternatives