TMS5700914APGEQQ1
vs
TMX5700914APZQQ1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LQFP-144
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
32
|
|
| CPU Family |
CORTEX-R4F
|
|
| Clock Frequency-Max |
80 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G144
|
|
| JESD-609 Code |
e4
|
|
| Length |
20 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
64
|
|
| Number of Terminals |
144
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| RAM (bytes) |
131072
|
|
| ROM (words) |
1048576
|
|
| ROM Programmability |
FLASH
|
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
160 MHz
|
|
| Supply Voltage-Max |
1.32 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
20 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
1
|
| Date Of Intro |
|
2016-06-21
|
|
|
|
Compare TMS5700914APGEQQ1 with alternatives
Compare TMX5700914APZQQ1 with alternatives