TMS5702135DZWTQQ1
vs
TMS5702124DPGEQQ1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LFBGA,
|
LQFP-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
22
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| CPU Family |
CORTEX-R4
|
CORTEX-R4F
|
| Clock Frequency-Max |
80 MHz
|
80 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PBGA-B337
|
S-PQFP-G144
|
| Length |
16 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
16
|
16
|
| Number of External Interrupts |
|
|
| Number of I/O Lines |
144
|
144
|
| Number of Serial I/Os |
7
|
5
|
| Number of Terminals |
337
|
144
|
| Number of Timers |
45
|
41
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (bytes) |
262144
|
196608
|
| ROM (words) |
2097152
|
2097152
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.4 mm
|
1.6 mm
|
| Speed |
180 MHz
|
160 MHz
|
| Supply Current-Max |
700 mA
|
700 mA
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
16 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e4
|
| RAM (words) |
|
192
|
|
|
|
Compare TMS5702135DZWTQQ1 with alternatives
Compare TMS5702124DPGEQQ1 with alternatives