TN80C186XL12
vs
TS68C000MEB/C12.5A
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
INTEL CORP
|
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ, LDCC68,1.0SQ
|
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
Intel
|
|
| Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
|
|
| Address Bus Width |
20
|
|
| Bit Size |
16
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
25 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQCC-J68
|
|
| JESD-609 Code |
e0
|
|
| Length |
24.2316 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
5
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
68
|
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.83 mm
|
|
| Speed |
12 MHz
|
|
| Supply Current-Max |
62.5 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
24.2316 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
|
| Base Number Matches |
2
|
|
|
|
|
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