TPA2010D1YZFR vs MAX9700BEUB-T feature comparison

TPA2010D1YZFR Texas Instruments

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MAX9700BEUB-T Maxim Integrated Products

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MAXIM INTEGRATED PRODUCTS INC
Part Package Code BGA TSSOP
Package Description DSBGA-9 MO-187CBA, MICRO, SOP-10
Pin Count 9 10
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Texas Instruments
Bandwidth-Nom 20 kHz 22 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
JESD-30 Code S-PBGA-B9 S-PDSO-G10
JESD-609 Code e1 e0
Length 1.795 mm 3 mm
Moisture Sensitivity Level 1
Noise Figure-Nom 97 dB
Number of Channels 2 1
Number of Functions 1 1
Number of Terminals 9 10
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 2.5 W 1.6 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA9,3X3,20 TSSOP10,.19,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 1.1 mm
Supply Current-Max 4.9 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.795 mm 3 mm
Base Number Matches 1 1
Gain 12 dB
Technology BICMOS

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