TPA2011D1YFFR vs MAX9700DETB+ feature comparison

TPA2011D1YFFR Texas Instruments

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MAX9700DETB+ Analog Devices Inc

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA 10-LFCSP-3X3X0.75
Package Description DSBGA-9
Pin Count 9 10
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Samacsys Manufacturer Texas Instruments Analog Devices
Bandwidth-Nom 20 kHz 22 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
JESD-30 Code S-XBGA-B9 S-XDSO-N10
JESD-609 Code e1 e3
Length 1.6 mm 3 mm
Moisture Sensitivity Level 1 1
Noise Figure-Nom 95 dB
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 9 10
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 3.2 W 0.8 W
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VFBGA HVSON
Package Equivalence Code BGA9,3X3,16 SOLCC10,.11,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 0.8 mm
Supply Current-Max 2.5 mA 5.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Matte Tin (Sn) - annealed
Terminal Form BALL NO LEAD
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 3 mm
Base Number Matches 1 2
Manufacturer Package Code 10-LFCSP-3X3X0.75
Date Of Intro 2003-11-14
Gain 20 dB
Technology BICMOS

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