TPA2011D1YFFR vs SSM2317CBZ-REEL feature comparison

TPA2011D1YFFR Texas Instruments

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SSM2317CBZ-REEL Analog Devices Inc

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC ANALOG DEVICES INC
Part Package Code BGA BGA
Package Description DSBGA-9 WLCSP-9
Pin Count 9 9
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Texas Instruments Analog Devices
Bandwidth-Nom 20 kHz 20 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
JESD-30 Code S-XBGA-B9 S-PBGA-B9
JESD-609 Code e1 e1
Length 1.6 mm 1.46 mm
Moisture Sensitivity Level 1 1
Noise Figure-Nom 95 dB
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 9 9
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 3.2 W 3 W
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA9,3X3,16 BGA9,3X3,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 0.655 mm
Supply Current-Max 2.5 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.6 mm 1.46 mm
Base Number Matches 1 1
Manufacturer Package Code CB-9-2
Gain 18 dB
Harmonic Distortion 10%

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Compare SSM2317CBZ-REEL with alternatives