TPA301D
vs
LM386MMX-1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
GREEN, PLASTIC, MS-012AA, SOIC-8
|
0.118 INCH, MSOP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Bandwidth-Nom |
20 kHz
|
300 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Harmonic Distortion |
0.5%
|
10%
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Power-Nom |
0.35 W
|
0.325 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.25
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Current-Max |
1.5 mA
|
8 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
12 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
4 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| Gain |
|
46 dB
|
|
|
|
Compare TPA301D with alternatives
Compare LM386MMX-1 with alternatives