TPD2002F vs GTL2002GM,125 feature comparison

TPD2002F Toshiba America Electronic Components

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GTL2002GM,125 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SSOP QFN
Package Description SSOP, SOP24,.3,40 XQFN-8
Pin Count 24 8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G24 S-PQCC-N8
JESD-609 Code e0 e4
Length 13 mm 1.6 mm
Number of Functions 1 1
Number of Terminals 24 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP HVQCCN
Package Equivalence Code SOP24,.3,40 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 0.5 mm
Supply Current-Max 10 mA
Supply Voltage-Max 5.25 V 2.64 V
Supply Voltage-Min 4.75 V 2.36 V
Supply Voltage-Nom 5 V 2.5 V
Supply Voltage1-Max 25 V 3.6 V
Supply Voltage1-Min 6 V 3 V
Surface Mount YES YES
Technology BCDMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1 mm 0.5 mm
Terminal Position DUAL QUAD
Width 6 mm 1.6 mm
Base Number Matches 1 1
Manufacturer Package Code SOT902-2
Samacsys Manufacturer NXP
Additional Feature ALSO OPERARTES AT 3.3V SUPPLY
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Supply Voltage1-Nom 3.3 V
Time@Peak Reflow Temperature-Max (s) 30

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