TPS61182RTETG4
vs
MCP1662-E/MNY
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC16,.12SQ,20
|
HVSON,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT ALSO NEED 5 TO 24 V VBAT SUPPLY
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-PQCC-N16
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Segments |
6
|
6
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
3.6 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.4 V
|
| Supply Voltage-Nom |
3.15 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare TPS61182RTETG4 with alternatives
Compare MCP1662-E/MNY with alternatives