TPS63060MDSCTEP
vs
MCP1633T-E/MG
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
WSON-10
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
Additional Feature |
ALSO OPERATES IN ADJUSTABLE MODE FROM 2.5 TO 8V
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
12 V
|
5.5 V
|
Input Voltage-Min |
2.5 V
|
3 V
|
Input Voltage-Nom |
5 V
|
5 V
|
JESD-30 Code |
S-PDSO-N10
|
S-PQCC-N16
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Current-Max |
1 A
|
|
Output Voltage-Max |
8 V
|
|
Output Voltage-Min |
2.5 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.8 mm
|
0.9 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK-BOOST
|
BUCK-BOOST
|
Switching Frequency-Max |
2600 kHz
|
2200 kHz
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
9 Weeks, 4 Days
|
|
|
|
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