TS(X)PC860MHMGB/Q50C
vs
MPC885ZP66
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
CERAMIC, BGA-357
|
PLASTIC, BGA-357
|
Pin Count |
357
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
5A002.A.1
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B357
|
S-PBGA-B357
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
357
|
357
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
50 MHz
|
66 MHz
|
Supply Voltage-Max |
3.465 V
|
1.9 V
|
Supply Voltage-Min |
3.135 V
|
1.7 V
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
No
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e0
|
Length |
|
25 mm
|
Moisture Sensitivity Level |
|
3
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA357,19X19,50
|
Peak Reflow Temperature (Cel) |
|
245
|
Seated Height-Max |
|
2.52 mm
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
25 mm
|
|
|
|
Compare TS(X)PC860MHMGB/Q50C with alternatives
Compare MPC885ZP66 with alternatives