TS(X)PC860MHMGB/Q50C vs TS(X)PC860MHMZPB/C40(A) feature comparison

TS(X)PC860MHMGB/Q50C Teledyne e2v

Buy Now Datasheet

TS(X)PC860MHMZPB/C40(A) Teledyne e2v

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL GRENOBLE ATMEL GRENOBLE
Part Package Code BGA BGA
Package Description , ,
Pin Count 357 357
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-CBGA-B357 S-PBGA-B357
Low Power Mode NO NO
Number of Terminals 357 357
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 50 MHz 40 MHz
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 2
Screening Level MIL-STD-883 Class B

Compare TS(X)PC860MHMGB/Q50C with alternatives

Compare TS(X)PC860MHMZPB/C40(A) with alternatives