TS3USB221RSER
vs
NX3DV221GM,115
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
GREEN, PLASTIC, MO-288UEFD, UQFN-10
|
2 X 1.55 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT1049-2, QFN-10
|
| Pin Count |
10
|
10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
NXP
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
|
| Bandwidth-Nom |
1100 MHz
|
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
|
|
| JESD-30 Code |
R-PQCC-N10
|
R-PQCC-N10
|
| JESD-609 Code |
e4
|
e3
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Normal Position |
NO
|
|
| Number of Channels |
2
|
6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Off-state Isolation-Nom |
41 dB
|
38 dB
|
| On-state Resistance Match-Nom |
0.2 Ω
|
0.1 Ω
|
| On-state Resistance-Max (Ron) |
6 Ω
|
7 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
VQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.6 mm
|
0.5 mm
|
| Supply Current-Max (Isup) |
0.03 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
17 ns
|
23 ns
|
| Switch-on Time-Max |
10 ns
|
50 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.58 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.5 mm
|
1.55 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
SOT1049-2
|
| Factory Lead Time |
|
24 Weeks, 5 Days
|
| Package Equivalence Code |
|
LCC10,.06X.08,20
|
| Technology |
|
CMOS
|
|
|
|
Compare TS3USB221RSER with alternatives
Compare NX3DV221GM,115 with alternatives