TS5A1066YEPR
vs
MC74VHC1GT66DTT1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
BGA
|
TSOP-5
|
| Package Description |
VFBGA, BGA5,2X3,20
|
SOT-23, TSOP-5
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PBGA-B5
|
R-PDSO-G5
|
| Length |
1.4 mm
|
3 mm
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
68 dB
|
80 dB
|
| On-state Resistance-Max (Ron) |
80 Ω
|
60 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSSOP
|
| Package Equivalence Code |
BGA5,2X3,20
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
5.5 ns
|
50 ns
|
| Switch-on Time-Max |
13 ns
|
50 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
0.9 mm
|
1.5 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
483
|
| JESD-609 Code |
|
e0
|
| Output |
|
SEPARATE OUTPUT
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TS5A1066YEPR with alternatives
Compare MC74VHC1GT66DTT1 with alternatives