TS5A1066YEPR
vs
SN74LVC1G66DBVTG4
feature comparison
| Part Life Cycle Code |
Obsolete
|
Lifetime Buy
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
SOT-23
|
| Package Description |
VFBGA, BGA5,2X3,20
|
LSSOP, TSOP5,.11,37
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PBGA-B5
|
R-PDSO-G5
|
| Length |
1.4 mm
|
2.9 mm
|
| Normal Position |
NO
|
NC
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
68 dB
|
42 dB
|
| On-state Resistance-Max (Ron) |
80 Ω
|
20 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
LSSOP
|
| Package Equivalence Code |
BGA5,2X3,20
|
TSOP5,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
1.45 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
5.5 ns
|
6.9 ns
|
| Switch-on Time-Max |
13 ns
|
6.5 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
0.9 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Bandwidth-Nom |
|
300 MHz
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| On-state Resistance Match-Nom |
|
12 Ω
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Signal Current-Max |
|
0.1 A
|
| Supply Current-Max (Isup) |
|
0.01 mA
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TS5A1066YEPR with alternatives
Compare SN74LVC1G66DBVTG4 with alternatives