TS68000CP10
vs
MC68HC000P16
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
MOTOROLA INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
PLASTIC, DIP-64
|
DIP, DIP64,.9
|
Pin Count |
64
|
64
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
10 MHz
|
16.67 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
R-PDIP-T64
|
R-PDIP-T64
|
JESD-609 Code |
e0
|
e0
|
Length |
81.535 mm
|
81.535 mm
|
Low Power Mode |
NO
|
NO
|
Number of DMA Channels |
|
|
Number of External Interrupts |
7
|
7
|
Number of Serial I/Os |
|
|
Number of Terminals |
64
|
64
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP64,.9
|
DIP64,.9
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
5.59 mm
|
5.84 mm
|
Speed |
10 MHz
|
16.67 MHz
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
NMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
22.86 mm
|
22.86 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
Supply Current-Max |
|
50 mA
|
|
|
|
Compare TS68000CP10 with alternatives
Compare MC68HC000P16 with alternatives