TS68020MRB/C25
vs
MC68020RC33E
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
MOTOROLA INC
|
Part Package Code |
PGA
|
PGA
|
Package Description |
,
|
PGA,
|
Pin Count |
114
|
114
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
25 MHz
|
33 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CPGA-P114
|
S-CPGA-P114
|
Low Power Mode |
YES
|
NO
|
Number of Terminals |
114
|
114
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Speed |
25 MHz
|
33 MHz
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Length |
|
34.545 mm
|
Number of DMA Channels |
|
|
Number of External Interrupts |
|
7
|
Number of Serial I/Os |
|
|
On Chip Data RAM Width |
|
|
Package Code |
|
PGA
|
RAM (words) |
|
0
|
Seated Height-Max |
|
3.81 mm
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
34.545 mm
|
|
|
|
Compare TS68020MRB/C25 with alternatives
Compare MC68020RC33E with alternatives