TS68882MFB/C16
vs
MC68882FN16
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
|
Package Description |
QFP,
|
PLASTIC, LCC-68
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
5
|
5
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
16.67 MHz
|
16.67 MHz
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-CQFP-G68
|
S-PQCC-J68
|
Length |
24.13 mm
|
24.205 mm
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Seated Height-Max |
3.43 mm
|
4.57 mm
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.13 mm
|
24.205 mm
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
Base Number Matches |
1
|
1
|
Barrel Shifter |
|
YES
|
Bus Compatibility |
|
MC68882
|
Package Equivalence Code |
|
LDCC68,1.0SQ
|
|
|
|
Compare TS68882MFB/C16 with alternatives
Compare MC68882FN16 with alternatives