TS68882VF25
vs
MC68881RC20
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
MOTOROLA INC
|
Part Package Code |
QFP
|
|
Package Description |
CERAMIC, QFP-68
|
PGA, PGA68,10X10
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-CQFP-G68
|
S-CPGA-P68
|
JESD-609 Code |
e0
|
e0
|
Length |
24.13 mm
|
26.92 mm
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFP
|
PGA
|
Package Equivalence Code |
QFP68,1.1SQ,50
|
PGA68,10X10
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.43 mm
|
2.59 mm
|
Supply Current-Max |
136 mA
|
150 mA
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Width |
24.13 mm
|
26.92 mm
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, FLOATING POINT ACCELERATOR
|
Base Number Matches |
5
|
3
|
Address Bus Width |
|
6
|
Barrel Shifter |
|
YES
|
Boundary Scan |
|
NO
|
Bus Compatibility |
|
MC68020
|
Clock Frequency-Max |
|
20 MHz
|
External Data Bus Width |
|
32
|
|
|
|
Compare TS68882VF25 with alternatives
Compare MC68881RC20 with alternatives