TS68882VF25
vs
TS68882MF20
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
THOMSON ELECTRON TUBES & DEVICES CORP
|
THOMSON ELECTRON TUBES & DEVICES CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XQFP-G68
|
S-XQFP-G68
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP68,1.1SQ,50
|
QFP68,1.1SQ,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
5
|
6
|
| Package Description |
|
QFP, QFP68,1.1SQ,50
|
| ECCN Code |
|
3A001.A.2.C
|
|
|
|